Quarterly Newsletter · Volume 1 , Issue 2 · July 1, 2009
Nef Rios Joins IPC Subcommittee for Flex Circuits
Nef Rios, our Operations Manager, became a member of the IPC D-12 Subcommittee for Flexible Circuits Performance Specifications and attended their meeting at the recent IPC APEX Expo in Las Vegas.
The committee is responsible for maintaining the IPC-6013 specification for single, double-sided, and multilayer rigid flex printed circuit boards.
At the March 29, 2009, meeting, the committee continued work on its current project of establishing High Density Interconnect (HDI) requirements for the IPC-6013 specification with the intent of phasing out the IPC-6016 specification. The topics of discussion included minimum annular ring for capture lands, the number of thermal stress cycles required, microsection magnification power (200X vs. 400X), lifted land requirements (IPC-6016 does not allow any), and a review of the crossreference chart between IPC-6010 and IPC-QL- 653.
IPC-6016 has not been updated for a number of years and with the number of HDI designs increasing, the committee feels it is best to merge the two specs into IPC-6013.
The next step for the committee is to review the minutes of their March meeting and prepare for the next meeting which will be held on September 22, 2009, in Schaumburg, IL.
Nef has been with Cosmotronic for 17 years. He joined the company shortly after receiving his Bachelor of Science degree in Electrical Engineering from the University of California, Irvine, in 1992.
Nef has held a number of management positions for Cosmotronic including Quality Manager and Engineering Manager. He is CID certified per IPC for Printed Wiring Board designs.
According to its Mission Statement, the IPC is a global trade association dedicated to furthering the competitive excellence and financial success of its members. IPC devotes resources to management improvement and technology enhancement programs, the creation of relevant standards, protection of the environment, and pertinent government relations. IPC encourages the active participation of all its members in these activities and commits to full cooperation with all related organizations.
Tradeshows are a Major Part of Cosmotronic’s Marketing Strategy
Exhibiting in regional tradeshows is a key component in Cosmotronic's sales and marketing plan. Over the course of the last year, we have participated in a number of tradeshows across the country in a effort to identify new business opportunities and emerging markets and technologies.
Along with our sister companies, Winonics and Bench2Bench Technologies, we’ve exhibited at the PCB West show last September in Santa Clara, CA, the Medical Design & Manufacturing Show last February in Anaheim, CA, the PCB East Show in Waltham, MA, at the end of April, the Del Mar, CA, Electronics show in May, and the Military & Aerospace Electronics Forum in San Diego, CA, last month. In September of this year, we will exhibit at both the PCB West Show in Santa Clara, CA, and the Orange County Electronics Show in Costa Mesa, CA. Our participation in each of these tradeshows has resulted in numerous new business opportunities, many of which have developed into new customers. Along with our website, tradeshows are one of the best ways to make sure that potential customers know about us.
Other Newsletters
Volume 1 Issue 1 · April 1, 2009
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