Technology

Cosmotronic has been an industry leader in providing our diverse customer base with leading edge PCBs for nearly 45 years.

High Reliability Rigid Boards Rigid Boards

High Reliability Flexible Circuits Flexible Circuits

High Reliability Rigid Flex Rigid Flex

Today we specialize in fabricating all types of Rigid, Rigid-Flex and Flexible Circuits that meet the toughest commercial, military and aerospace applications.

Our capabilities include:

  • Bookbinder Circuits
  • Controlled Impedance
  • High frequency Applications
  • Heavy Metals
  • Heat Sinks and Metal Cores
  • Blind and Buried Vias
  • Micro Vias - Epoxy or Copper Filled
  • Multiple Surface Finishes
  • A Wide Range of Substrate Materials

Panel sizes up to 18x24" are typically used, however, we can go with larger panel sizes for special applications. We can meet your circuit requirements regardless if it's a one layer design or requires 30 layers. We routinely work to the requirements of IPC-6013 class 3 for high reliability commercial and military/aerospace flexible circuit applications, as well as, IPC-6012 Class 3, and 3A for the most stringent rigid PCB needs. Cosmotronic is qualified to certify boards to military specifications MIL-PRF-31032, MIL-P-50884, and MIL-PRF-55110

Our products are prepared for production by some of the industries most experienced CAM operators, utilizing the Valor Genesis CAM software developed by Orbotech(r). The Cosmotronic Engineering department routinely reviews jobs for circuit producibility as it relates to Design for Manufacturability (DFM) and will provide inputs and suggestion if issues or opportunities arise.

Cosmotronic is equipped with the resources that can respond to your wide range of technical challenges. Please feel free to contact us if you would like us to provide your organization with a 'Lunch and Learn' meeting to discuss a variety of board design challenges or any other technical discussion that meet your needs.

Cosmotronic Printed Circuit Boards

Product Flexibility

  • Rigid Multilayers
  • Flex and Rigid-Flex
  • Metal Core & Bonded Heat Sinks
  • Blind and Buried Via’s
  • Backplane Assemblies

Processing Flexibility

  • Quick Turn - Pre/Production
  • Panel Sizes to 24" x 36"
  • Thickness to .400
  • Selection of Surface Finishes
  • Selection in Materials

Specification Flexibility (Military and Commercial)

  • MIL-PRF-31032
  • MIL-PRF-55110
  • MIL-P-50884
  • MIL-A-28870
  • AS9100:2004
  • ISO 9001:2008
  • IPC-6012 Class 2 & 3
  • IPC-6013 Class 2 & 3
  • UL 94V-0 File: E 48895

Technology Roadmap

Standard
Technology

Advanced
Technology

Future
Technology

Frequency

Comments

Technologies
Defined

This runs thru the shop on a regular basis and requires no special handling or involvement from key personnel. High Yields.

This runs thru the shop occasionally and runs with minimal special handling or involvement from key personnel. Reduced Yields.

This rarely runs thru the shop and only with special handling or involvement from key personnel. Significant impact on Yields.

Designs with these parameters are fabricated Daily, Weekly, Monthly, Quarterly, Annually or Never.

Feature

Minimum Outer Line Width

0.005

0.004

0.003

Assumes 1/2 oz copper & +/-20% tolerance

Minimum Inner Line Width

0.004

0.004

0.003

Assumes 1/2 oz copper & +/-20% tolerance

Minimum Outer Space
(Trace\Trace & Trace\Pad)

0.005

0.004

0.003

Assumes 1/2 oz copper & +/-20% tolerance

Minimum Inner Space
(Trace\Trace & Trace\Pad)

0.004

0.003

0.003

Assumes 1/2 oz copper & +/-20% tolerance

Internal Etch tolerance (+/-)

0.0007

0.0007

0.0005

Assumes 1/2 oz copper

External Etch tolerance (+/-)

0.0012

0.001

0.0007

Assumes 1/2 oz copper - starting

Minimum Space,
Conductor to PWB Edge

0.012

0.010

0.008

Layer to Layer Registration
(multilayer PWB)

+/- .008

+/- .006

+/- .004

Layer to Layer Registration
(2 layer core)

+/- .004

+/- .002

+/- .001

Minimum Dielectric Thickness (inches)

0.004

0.003

0.002

Maximum PWB Thickness (inches)

0.250

0.350

0.400

Maximum Board Thickness Tolerance

+/- 10%

+/- 8%

+/- 5%

Maximum Numbers of Layer

20

30

36

Profile Tolerance

+/- .005

+/- .004

+/- 0.003

values for rigid boards/sections only

Minimum Internal Cut-out Radius

0.048

0.032

0.016

Pad and Hole

Minimum Finished Plated Hole Size

0.008

0.006

0.006

Component Finished PTH Size Tolerance

0.002

0.002

0.001

Via Finished PTH Size Tolerance

0.004

0.003

0.002

PTH Locational Tolerance

0.003

0.003

0.003

Internal Land Size (Diameter over Drill)

0.01

0.008

0.008

Assumes .001
annular ring

Internal Anti-pad (Diameter over Drill)

0.02

0.016

0.015

External Land Size (Diameter over Finished Hole)

0.008

0.006

0.006

Assumes .002
annular ring

Min. Internal Plated Hole to Trace Spacing

0.008

0.006

0.004

Standard

Advanced

Future

Frequency

Comments

Drilling

Smallest Mechanical Drill Size

0.012

0.010

0.008

Maximum Aspect Ratio (w/ min. drill)

8:1

9:1

15:1

Maximum Drill Hole Size

0.257

0.257

0.257

NPTH Size Tolerance (+/- inches)

0.002

0.001

0.001

NPTH Locational Tolerance (+/- inches)

0.003

0.003

0.002

Min. Outer Non-Plated Hole to Trace Spacing

0.012

0.010

0.008

Min. Inner Non-Plated Hole to Trace Spacing

0.012

0.010

0.008

Back Drilled Vias (High Speed Transitions)

No

No

Yes

D-W-M-Q-A-N

Blind/Buried Vias (All Types)

Yes

Yes

Yes

D-W-M-Q-A-N

Via Fill (Conductive) (Via in Pad)

No

Yes

Yes

D-W-M-Q-A-N

Typ: DuPont CB-100,
others as specified

Via Fill (Non-Conductive)

No

Yes

Yes

D-W-M-Q-A-N

Typ: Peters PP-2795;
others as specified

Solder Mask

Minimum LPI Soldermask Dam

0.004

0.003

0.003

Soldermask Registration (+/-) or Clearance per side

0.004

0.003

0.002

Dry Film Soldermask

Yes

Yes

Yes

D-W-M-Q-A-N

DuPont Vacrel 8140 10%

Photimageable Coverlay

Yes

Yes

Yes

D-W-M-Q-A-N

Dupont PC-1000 series

LPI Soldermask

Yes

Yes

Yes

D-W-M-Q-A-N

Taiyo PSR-4000 80%

Soldermask Via Plug w/LPI

Yes

Yes

Yes

D-W-M-Q-A-N

Taiyo PSR-4000 5%

Soldermask Via Fill w/LPI

Yes

Yes

Yes

D-W-M-Q-A-N

Taiyo PSR-4000 5%

Soldermask Laser Ablation

No

No

No

D-W-M-Q-A-N

Soldermask using Laser Direct Imaging

No

No

No

D-W-M-Q-A-N

Available Colors

Green, Blue, Red, Black, Clear

Standard

Advanced

Future

Frequency

Comments

Materials

Standard Panel Size

18 x 24

18 x 24

18 x 24

Maximum Panel Size

23 x 29

24 x 36

24 x 36

Maximum Board Size

21 x 27

22 x 34

22 x 34

Fabricated Dimension Tolerances (+/- inches)

0.005

0.003

0.002

Minimum Dielectric Thickness

0.004

0.003

0.002

.002" std; .001" advanced for Flex

Minimum Copper Weight - Inner Layers (oz)

0.5

0.25

5 µm

Minimum Copper Weight - Outer Layers (oz)

0.5

0.25

0.25

Maximum Copper Weight - Inner Layers (oz)

3

5

6

Standard foils stocked: 1/2, 1, 2 oz.

Maximum Copper Weight - Outer Layers (oz)

4

5

6

Standard foils stocked: 1/2, 1, 2 oz.

Epoxy Glass (150C Tg min)

Yes

Yes

Yes

D-W-M-Q-A-N

Material is NOT stocked; local availability

Epoxy Glass (170C Tg min)

Yes

Yes

Yes

D-W-M-Q-A-N

Material IS stocked

Polyimide Glass

Yes

Yes

Yes

D-W-M-Q-A-N

Some material stocked; local suppliers

Polyimide Thermount

Yes

Yes

Yes

D-W-M-Q-A-N

Material is NOT stocked; availability limited

Resin Coated Copper (for HDI)

No

No

Yes

D-W-M-Q-A-N

Material is NOT stocked

IPC-4101/25 (PPO, GeTek)

Yes

Yes

Yes

D-W-M-Q-A-N

Material is NOT stocked; local availability

Nelco 4000-13

Yes

Yes

Yes

D-W-M-Q-A-N

Material is NOT stocked; local availability

Rogers 4003/4403

No

Yes

Yes

D-W-M-Q-A-N

Material is NOT stocked

LCP

No

Yes

No

D-W-M-Q-A-N

NOT stocked; initial tests NOT promising.

Teflons (Rogers 6002, 5880, Ultralam)

No

Yes

Yes

D-W-M-Q-A-N

Material is NOT stocked; SS/DS only

Teflon-Mixed Dielectric

No

Yes

Yes

D-W-M-Q-A-N

Is material Stocked?

Speedboard C

No

Yes

Yes

D-W-M-Q-A-N

Material is NOT stocked

RF Bonding (9250, 6750, FEP, PFA, Fusion)

No

No

Yes

D-W-M-Q-A-N

Identify materials used. Is material Stocked?

CAF Resistant Epoxies

No

Yes

Yes

D-W-M-Q-A-N

Material is NOT stocked; local availability

Halogen Free Epoxies

No

Yes

Yes

D-W-M-Q-A-N

Material is NOT stocked

UL Approved Exotic Combinations

No

Yes

Yes

D-W-M-Q-A-N

Ohmega Ply

No

No

Yes

D-W-M-Q-A-N

Thick Film Polymer Resistors

No

No

Yes

D-W-M-Q-A-N

Buried Capacitance (i.e. BC2000)

No

No

Yes

D-W-M-Q-A-N

Thin core flex (1 mil polyimide, 5 micron copper)

No

Yes

Yes

D-W-M-Q-A-N

Standard

Advanced

Future

Frequency

Comments

Surface Finishes

Selective Solder Strip

Yes

Yes

Yes

D-W-M-Q-A-N

HASL

Yes

Yes

Yes

D-W-M-Q-A-N

Electroless Nickel Immersion Gold (ENIG)

Yes

Yes

Yes

D-W-M-Q-A-N

Uyemura (Superior), MacDermid (EFT)

Soft Bondable Gold (Deep)

Yes

Yes

Yes

D-W-M-Q-A-N

Hard Gold (Deep)

Yes

Yes

Yes

D-W-M-Q-A-N

Immersion Silver

Yes

Yes

Yes

D-W-M-Q-A-N

Enthone (EFT)

Organic Solderability Preservative (OSP)

Yes

Yes

Yes

D-W-M-Q-A-N

Enthone Entek 56 & 106 (EFT)

Immersion Tin

No

Yes

Yes

D-W-M-Q-A-N

FCT Omikron (EFT)

Carbon Paste

No

No

Yes

D-W-M-Q-A-N

Combination Finishes (i.e. Solder and Soft Gold)

No

Yes

Yes

D-W-M-Q-A-N

Edge Plating

Yes

Yes

Yes

D-W-M-Q-A-N

HDI

HDI Type (I, II, III, IV)

II

III

D-W-M-Q-A-N

Minimum Laser Via Drill Diameter 

0.006

0.005

D-W-M-Q-A-N

Laser Via Land Size (Diameter over Drill) 

0.008

0.006

D-W-M-Q-A-N

Laser Via Aspect Ratio

0.75:1

1:1

D-W-M-Q-A-N

Impedance

Single-ended (+/- %)

10

5

5

D-W-M-Q-A-N

50% share of impedance work

Differential, Edge-coupled (+/- %)

10

5

5

D-W-M-Q-A-N

25% share of impedance work

Differential, Broadside-Coupled (+/- %)

10

10

8

D-W-M-Q-A-N

25% share of impedance work

In-house Testing/Verification  (If No, Que Time)

Yes

Yes

Yes

Technology

Etch back

Yes

Yes

Yes

D-W-M-Q-A-N

CF4/O2 Plasma + KMnO4 desmear

B-Stage Backed PWBs

No

Yes

Yes

D-W-M-Q-A-N

B-Stage Backed PWBs with test points

No

Yes

Yes

D-W-M-Q-A-N

Copper Cores

Yes

Yes

Yes

D-W-M-Q-A-N

Typ: .020"-.030" thk; Both active & passive

Aluminum Cores

Yes

Yes

Yes

D-W-M-Q-A-N

Heat Sinks

Yes

Yes

Yes

D-W-M-Q-A-N

Exposed Cavities

No

Yes

Yes

D-W-M-Q-A-N

Backplanes

Yes

Yes

Yes

D-W-M-Q-A-N

Max size: 20"x 28"x 0.250"

Fusion Bonded Teflon

No

No

Yes

D-W-M-Q-A-N

Air Gap PWBs

No

No

No

D-W-M-Q-A-N

V-Cut (Scoring)

Yes

Yes

Yes

D-W-M-Q-A-N

Smallest BGA footprint pitch (mm)

1.27

0.75

0.75

D-W-M-Q-A-N

Standard

Advanced

Future

Frequency

Comments

Flex Capabilities

Multilayer Flex

Yes

Yes

Yes

D-W-M-Q-A-N

10%

Rigid Flex

Yes

Yes

Yes

D-W-M-Q-A-N

40%

Flex Assembly

No

Yes

Yes

D-W-M-Q-A-N

5%

Assembly Functional Test

No

No

No

D-W-M-Q-A-N

Adhesiveless Flex

Yes

Yes

Yes

D-W-M-Q-A-N

80%

Bookbinder

No

Yes

Yes

D-W-M-Q-A-N

1%

Laser Skived Fingers

No

Yes

Yes

D-W-M-Q-A-N

3%

Scuplture Flex

No

No

No

D-W-M-Q-A-N

Button Plating of Flex

No

Yes

Yes

D-W-M-Q-A-N

5%

Silver Epoxy

Yes

Yes

Yes

D-W-M-Q-A-N

5%

Additional Capabilities

Embedded Discrete Ceramic Resistors

No

No

No

D-W-M-Q-A-N

Embedded Thick Film Polymer Resistors

No

No

No

D-W-M-Q-A-N

Ohmega Ply

No

No

No

D-W-M-Q-A-N

Embedded Capacitance

No

No

No

D-W-M-Q-A-N

Heavy Metal Backed

No

No

No

D-W-M-Q-A-N

Cavities

No

No

No

D-W-M-Q-A-N

Lead Time

24 Hour

Yes

No

No

D-W-M-Q-A-N

1 - 4 layer; no outside processes;

48 Hour

Yes

No

No

D-W-M-Q-A-N

1 - 8 layer; no outside processes;

3 Day

Yes

Yes

Yes

D-W-M-Q-A-N

Multilayer rigid, 1-4 lyr Rigid-flex;

5 Day

Yes

Yes

Yes

D-W-M-Q-A-N

Multilayer rigid, 1-10 lyr Rigid-flex;

10 Day

Yes

Yes

Yes

D-W-M-Q-A-N

15 Day and Greater

Yes

Yes

Yes

D-W-M-Q-A-N

Standard Lead Time

Yes

Yes

Yes

D-W-M-Q-A-N

Balance

Production Capability

Low, Prototype

Yes

Yes

Yes

D-W-M-Q-A-N

Volume: 1 - 50 pcs

Medium, Pre-Production

Yes

Yes

Yes

D-W-M-Q-A-N

Volume: 50 - 1000 pcs

High - Production

No

Yes

Yes

D-W-M-Q-A-N

Volume: > 1000 pcs/month

Quality

IPC-6012 CL1 (Breadboard)

Yes

Yes

Yes

D-W-M-Q-A-N

Best Commercial Practice

Yes

Yes

Yes

D-W-M-Q-A-N

IPC-6012 CL2

Yes

Yes

Yes

D-W-M-Q-A-N

IPC-6012 CL3 (Military)

Yes

Yes

Yes

D-W-M-Q-A-N

IPC-6012 CL3 (Hi-Rel)

Yes

Yes

Yes

D-W-M-Q-A-N

Yes

Yes

Yes

D-W-M-Q-A-N

Certified for GF,GI,BF,BI,BT materials, Types 1-3 with Etchback.

Yes

Yes

Yes

D-W-M-Q-A-N

Certified for Adhesive & Adhesiveless materials Types 1-4 with Etchback.

IPC-6013 (Flex, R-Flex)

Yes

Yes

Yes

D-W-M-Q-A-N

IPC-6016 (HDI/Micro-Via)

No

No

Yes

D-W-M-Q-A-N

IPC-6018 (RF)

Yes

Yes

Yes

D-W-M-Q-A-N