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Date Quote Needed By:


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BOARD DESIGN:
P/N or Name:

Type: select RIGID FLEX RIGID-FLEX METAL CORE EXTERNAL HEAT SINK ASSEMBLY REQUIRED

Specification: select IPC-6012, Class 2 IPC-6012, Class 3 IPC-6013, Class 2 IPC-6013, Class 3 MIL-PRF-55110 MIL-P-50884 MIL-PRF-31032 MIL-A-28870 IPC Class 1

Material: select EPOXY POLYMIDE THERMOUNT BT Rogers 4000 series OTHER

Please Specify Other:

Board Size: w X h  X (Thickness)

Number of Layers: Number of flex Layers:

Copper Weights (Start): Internal: select 1/2 oz. 1 oz. 2 oz. 3 oz. 4 oz. 5 oz. External: select 1/2 oz. 1 oz. 2 oz. 3 oz. 4 oz. 5 oz.

Minimum Trace / Space

Total Number of Holes:

Smallest Hole Size/Quantity: /

Blind Via’s on Layers: Buried Via’s on Layers:

SMT Count Top Layer: SMT Count Bottom Layer:

Board Surface Finish: select Tin/Lead reflow HASL Nickel/Gold (Immersion) Nickel/Gold (Electro Plate) Other

Please Specify Other:

Solder Mask: One Side select One Side Two Sides None

Solder Mask Material: select LPI Dry Film Epoxy

Via Tenting: select Yes No

Quantities Required / Delivery Required:
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Special Notes/Comments: